Two types of insulated metal substrates for surface mount technology (SMT) for automotive applications were thermally examined by means of the TRAIT method of P.E. Bagnoli, et al. (see IEEE Trans. on Power Electronics, vol. 13, p. 1208-19, 1998). The results showed a noticeably lower static thermal resistance than other solutions commonly used. Moreover, TRAIT analysis provided evidence that the residue thermal resistance has to be ascribed to the epoxy insulating layer of the IMS substrates, suggesting that the differences between different types of IMS substrates are due to differences in the dielectric deposition technology.


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    Title :

    Thermal analysis of insulated metal substrates for automotive electronic assemblies


    Contributors:


    Publication date :

    1999


    Size :

    7 Seiten, 13 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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