After improvement of the associated assembly system, the remaining automotive diode failures, at a level of over 4% in operation, were attributed to the internal strain based on RVT (rapid variation of temperature) test results. The X-ray diffraction spectra, or rocking curves, indicated the internal strain induced by the grinding and diffusion processes. New conditions for the diffusion process, which reduce the induced strain on the B-Al diffused side, were established. An important improvement in automotive diode reliability was obtained, with the failure percentages diminishing by a factor of between 4 and 8 in both operation and RVT tests.
Strain depending reliability of automotive diodes
1998
4 Seiten, 3 Quellen
Conference paper
English
Automotive electronics reliability handbook
TIBKAT | 1987
|High reliability automotive interconnections
Automotive engineering | 1987
|Reliability in automotive design
Automotive engineering | 1989
|Automotive Electronic Reliability Prediction
SAE Technical Papers | 1987
|Automotive electronic reliability prediction
Automotive engineering | 1987
|