This paper deals with the ageing parameters of high power IGBT modules in traction applications. Using the results of a number of power cycling tests on 400 A modules, it shows that, in addition to the junction temperature excursion, other parameters such as the maximal chip temperature and the current density are involved in thermal fatigue failures. Also, contact temperature measurements achieved on the IGBT chip surface in cycling conditions to localise the maximal thermomechanical stress are presented and are correlated with module failure analyses. The role of current density in the ageing process is finally shown by determining its influence on the chip surface temperature gradient.


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    Title :

    Effects of current density and chip temperature distribution on lifetime of high power IGBT modules in traction working conditions


    Contributors:
    Hamidi, A. (author) / Coquery, G. (author)


    Publication date :

    1997


    Size :

    4 Seiten, 4 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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