Some issues affecting surface mount solder joint life are addressed. Solder joint life expectancy depends on the level of stress experienced and the number of cycles of stress. Service life within a surface mount solder fillet follows mechanical failure models. These models predict failure at a predetermined number of cycles for different stress levels in the solder fillet. Fatigue in surface mount devices, castellations and surface finishes, life predictions, design criteria, manufacturing processes and controls, accelerated fatigue testing, and quality assurance provisions for solder joints are discussed. Each topic is introduced with a question expressing a concern relating to avionics integrity.
Surface mount solder joint issues impacting avionic integrity
Auswirkung von Oberflächenmontage-Lötverbindungen auf die Integrität der Avionik
1990
10 Seiten, 13 Quellen
Conference paper
English
In-Situ Monitoring of Joint Integrity for Condition Based Monitoring of Avionic Components
British Library Conference Proceedings | 2019
|NTIS | 1987
|NTIS | 1987
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