Some issues affecting surface mount solder joint life are addressed. Solder joint life expectancy depends on the level of stress experienced and the number of cycles of stress. Service life within a surface mount solder fillet follows mechanical failure models. These models predict failure at a predetermined number of cycles for different stress levels in the solder fillet. Fatigue in surface mount devices, castellations and surface finishes, life predictions, design criteria, manufacturing processes and controls, accelerated fatigue testing, and quality assurance provisions for solder joints are discussed. Each topic is introduced with a question expressing a concern relating to avionics integrity.


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    Title :

    Surface mount solder joint issues impacting avionic integrity


    Additional title:

    Auswirkung von Oberflächenmontage-Lötverbindungen auf die Integrität der Avionik


    Contributors:
    Lingg, C.L. (author)


    Publication date :

    1990


    Size :

    10 Seiten, 13 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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