Bonding requirements in general are discussed. The additional factors that are introduced for spacecraft bonding are examined and shown to require methods that are outside of normal bonding techniques. An electronic box in a spacecraft is used to illustrate the problems encountered.


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    Title :

    Unique bonding methods for spacecraft


    Additional title:

    Verbindungsverfahren fuer Raumfahrzeuge


    Contributors:


    Publication date :

    1988


    Size :

    6 Seiten



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English






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