Automotive electronics circuits have a dual need for being both cost effective in high volume manufacturing, and being able to survive harsh thermal excursions in the field. Current technology multilayer materials system can meet the performance requirements of the industry, but typically require many print and fire steps during circuit manufacture. A new cost-effective generation of thick film multilayer materials was developed and qualified for use in an engine control circuit. Key features of the system are a dielectric that survives -40 deg C to +125 deg C thermal cycle excursions with soldered components, along with good electrical reliability at 30 micron fired thickness instead of the usual 40 micron, 200 micron pitch Ag-Pt and Ag-Pd conductors; +/-75 ppm/deg C resistors that have less than 0.5 % drift, and the ability to cofire via fill, conductor and dielectric. The cofire aspect, along with a dielectric that can achieve the required reliability with two points instead of the traditional three, plus the ability to fill the vias with one print instead of two, has resulted in the elimination of two printing steps and four firing steps for a two metal layer circuit with significant cost savings. Engine control modules using the new materials are currently entering the low volume production phase.


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    Title :

    Next-generation engine control modules using advanced multilayer technology materials


    Additional title:

    Eine neue Generation von Modulen für die Motorsteuerung in einer verbesserten Mehrschichttechnologie


    Contributors:


    Publication date :

    1996


    Size :

    6 Seiten, 7 Bilder, 3 Tabellen, 6 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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