This paper describes the implementation of chip on board technology to reduce manufacturing costs and improve the performance of several complex circuit modules now in use in military systems. High cost digital avionics circuit modules discussed in this paper include the HAC-32, a general purpose computer circuit now packaged in a single MCM and a Single Module Processing Element which utilizes three MCMs. In addition, a chip on board conversion of a hybrid electronic circuit used in tactical field equipment is described. The paper includes a discussion of protective coating required to assure protection against harsh environments, related test techniques, and challenges that were encountered in construction of the modules.
Application of Chip-on-Board (COB) technology in military systems
Anwendung der Chip-on-Board-Technologie (COB) in militärischen Systemen
1996
6 Seiten, 3 Bilder, 1 Quelle
Conference paper
English
Halbleitertechnologie , Chip-Montage , Avionik , Luftwaffe , Kostensenkung , Multichip-Schaltung , digitale integrierte Schaltung , Prozessrechner , Hybridschaltung , Schutzschicht , elektronische Kampfführung , Prüfverfahren , In-circuit-Prüfung , Plasmaabscheidung , Siliciumnitrid , Dünnschichttechnik , Korrosionsbeständigkeit , Feuchte , Goldlegierung , Bonden , leitfähiger Kunststoff , beschleunigte Prüfung , Temperaturwechselbeständigkeit , mechanische Spannung , Vibration , CoB (Chip-on-Board)
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