One feature of a smart structure implies that some computational and signal processing capability can be performed at a local level, perhaps integral to the controlled structure. This requires electronics with a minimal mechanical influence regarding structural stiffening, heat dissipation, weight, and electrical interface connectivity. The Advanced Controls Technology Experiment II (ACTEX lI) space-flight experiment implemented such a local control electronics scheme by utilizing composite smart members with integral processing electronics. These microelectronics, tested to MIL-STD-883B levels, were fabricated with conventional thick film on ceramic multichip module techniques. Kovar housings and aluminum-kapton multilayer insulation was used to protect against harsh space radiation and thermal environments. Development and acceptance testing showed the electronics design was extremely robust, operating in vacuum and at temperatures ranging from -42 deg F to 236 deg F. The worst electronics unit showed a maximum of 15 dB gain change over this temperature range with minimal gain variations occurring just above room temperatures. Four electronics modules, used for the flight hardware configuration, were connected by a RS-485 2 Mbit per second serial data bus. An Intel 80C196KD microprocessor was chosen as the digital compensator in each controller. It was used to apply a series of selectable biquad filters, implemented via delta transforms. Instability in any compensator was expected to appear as large amplitude oscillations in the deployed structure. Instabilities were most detectable by large temperature increases in the electronics, typically noticeable within minutes of unstable operation.
Experiences with integral microelectronics on smart structures for space
Versuche im Weltraum mit in smarten Strukturen integrierter Mikroelektronik
1995
11 Seiten, 12 Bilder, 1 Tabelle, 4 Quellen
Conference paper
English
Keynote: Space Microelectronics
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