The evolution of automotive electronics packaging is being accelerated by the increased use of electronics in all vehicles. Automotive electronics must meet some of the most severe environmental conditions, maintain exceptional reliability and achieve cost targets that rival the most competitive consumer products. To achieve these goals and assure cost reduction with performance/function improvements, the technologies that introduced surface mount packaging technologies (SMT) 10 years ago, are now ready to be challanged and potentially replaced with new higher definition technologies and processes. MCM technology in 1995 is analogous to SMT in 1985 in terms of an equivalent level of infrastructure development. This paper will identify the problem areas associated with MCM packaging technologies and the approach to resolving the technical issues. The final objective of this research and development effort is to develop low-cost, high density substrates, and fine pitch wire bond and low cost flip chip assembly technologies to support low-cost, ball grid array multichip modules for automotive and aerospace applications.
Consortium for automotive electronics: an approach to MCM technology development
Eine gemeinsame Entwicklung der KFZ-Elektronik in Multichip-Technologie
1995
18 Seiten, 1 Bild, 10 Quellen
Conference paper
English
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