This paper presents a fiber optic packaging technique using qualifiable materials and processes that has been developed for space applications. The technique is consistent with a Multi Chip Module (MCM) implementation. This packaging technique allows multiple fiber optic interfaces to be combined with high density electronics within a single easily integrable package and can be used wherever fiber optics are incorporated into spaceborne systems, including the Fiber Optic Data Bus (FODB), the Space Station FDDI interface, any upgrades of the Space Station Local Bus from 1553 to 1773, and various Dual Rate 1773 applications.


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    Title :

    Fiber optic MCM for spaceborne applications


    Additional title:

    Multichip-Schaltungen mit Faseroptik für die Raumfahrttechnik


    Contributors:
    Bristow, J. (author) / Lehman, J. (author) / Liu, Y. (author) / Goldberg, T. (author) / DeRuiter, J. (author) / Kersch, D. (author)


    Publication date :

    1994


    Size :

    10 Seiten, 9 Bilder, 5 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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