Thick film silver conductor provide a cost effective approach for the fabrication of automotive hybrids. Two prototype, underhood automotive hybrids have been fabricated using chip and wire assembly. A thick film encapsulant was printed to prevent silver migration between the conductor traces. For assembly, gold wire was thermosonically bonded directly to the thick film silver pads. The exposed silver bonds pads were encapsulated in the same process step in which liquid encapsulant was applied to protect the semiconductor die. One of the hybrid circuits has been successfully demonstrated in test cars and the other is currently being tested. Thermally cycling, high temperature storage, boiling water, and biased humidity storage tests have been performed on tests structures to evaluate the integrity of the construction.


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    Title :

    Thick film silver multilayers for under-the-hood automative applications


    Additional title:

    Mehrschichtschaltung in Dickschichttechnik mit Silber für die Kraftfahrzeugelektronik


    Contributors:
    Aday, J. (author) / Johnson, R.W. (author) / Evans, J.L. (author) / Romanczuk, C. (author)


    Publication date :

    1993


    Size :

    6 Seiten, 5 Bilder, 5 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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