Martin Marietta has developed a viable plan to realize COB assemblies without costly redesigns which is fully hermetic per current military requirements and can be easily modified to create full COB with suitable chip encapsulant for future military and aerospace applications. COB has been used for a number of years in the commercial world to realize low cost and light weight consumer electronic products. It has been the intent of the government and the military to follow the example set by the commercial industry. However, concerns have abound over the technologies long term reliability. Because of this, full qualification of COB for military and space applications is still some term reliability. Because of this, full qualification of COB for miltary and space applications is still some years away. This paper summarizes the combined experiences of Martin Marietta and DuPont Electronics in the design and development of a large area Green Tape substrate which incorporates large area Kovar seal rings resulting in an integrated substrate package structure.
SEM-E hermetic-LTCC 'Road map to military chip-on-board'
Hermetisch versiegelte integrierte Schaltungen auf Tieftemperatur-Keramiksubstraten: Ein Weg zum militärischen Einsatz von 'Chip-on-Board'-Technik
1992
6 Seiten, 6 Bilder, 3 Quellen
Conference paper
English
Keramik , Sintern , Zuverlässigkeit , elektronische Kampfführung , Wehrtechnik , USA (United States of America) , VLSI-Schaltung , Halbleitersubstrat , Mehrschichtschaltung , Entwicklungsstand , Polymer , Kunststoffgehäuse , Kunstharz , Packungsdichte (Schaltung) , Multichip-Schaltung , Metallisieren , CoB (Chip-on-Board) , Niedertemperatureinbrandkeramik
Emerald Group Publishing | 1998
British Library Online Contents | 1999