Advanced avionics systems are operating at continually higher data rates, imposing difficult bandwidth and bit error rate constraints on system interconnections. Additionally, the interconnection system must operate with high reliability in severe vibration and temperature environments. This paper describes optical interconnection and packaging technologies which were developed to meet these requirements and which offer many advantages over conventional electrical interconnections. Rack-to-rack connections and module-to-module interconnections, via a rack backplane, are typical aircraft applications for optical interconnects. For these applications, a prototype optical backplane was designed. Optical interconnections are via multi-mode, graded index optical fibers, encapsulated in polyurethane and attached to a mechanical stiffener. For interconnections internal to the LRMs, optical waveguides are an attractive alternative. High temperature, multi-mode polymer waveguide test structures fabricated for this application are discussed.


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    Title :

    Advanced packaging technologies for optical interconnection of avionics systems


    Additional title:

    Fortschrittliche Montagetechnologien für die optische Verbindungstechnik von Avionik-Systemen


    Contributors:
    Cotti, B. (author) / Schroeder, J.E. (author)


    Publication date :

    1992


    Size :

    15 Seiten, 12 Bilder



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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