We present a newly developed 4500 V and 2000 A Press-Pack IGBT module for power transmission and industrial voltage drives applications. The module employs SPT IGBT chips with exceptionally low losses and high Safe Operating Area (SOA). The use of SPT IGBT chips in this Press Pack IGBT module allows for higher power densities and the package provides a highly flexible modular platform with very good ruggedness.


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    Title :

    IGBT Press-packs for the industrial market


    Contributors:


    Publication date :

    2012


    Size :

    8 Seiten, 11 Bilder, 10 Quellen



    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English




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