Power electronic applications for hybrid as well as for electric vehicles have a tendency to be based on liquid water cooling system in order to optimize the power density and keep the system compact. In this paper, we present a new concept for a cold plate, based on a new aluminium-copper (AlCu) clad substrate with copper on the top for soldering and a structured aluminium lower side for cooling. This solution is cost efficient, dispenses with nickel plating and helps to reduce the weight of the application. The analysis shows that the thermal performance of the AlCu-clad material is more than 9 % better than an adequate aluminium configuration.


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    Title :

    A new base plate concept on the basis of aluminium-copper clad materials


    Contributors:


    Publication date :

    2012


    Size :

    6 Seiten, 14 Bilder, 4 Quellen



    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English





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