Power electronic applications for hybrid as well as for electric vehicles have a tendency to be based on liquid water cooling system in order to optimize the power density and keep the system compact. In this paper, we present a new concept for a cold plate, based on a new aluminium-copper (AlCu) clad substrate with copper on the top for soldering and a structured aluminium lower side for cooling. This solution is cost efficient, dispenses with nickel plating and helps to reduce the weight of the application. The analysis shows that the thermal performance of the AlCu-clad material is more than 9 % better than an adequate aluminium configuration.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    A new base plate concept on the basis of aluminium-copper clad materials


    Beteiligte:


    Erscheinungsdatum :

    2012


    Format / Umfang :

    6 Seiten, 14 Bilder, 4 Quellen



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Datenträger


    Sprache :

    Englisch





    Resin transportation device for copper-clad plate production

    WANG JUNRONG / CHENG TONG / CHENG QIANXIA et al. | Europäisches Patentamt | 2023

    Freier Zugriff

    FILM, COPPER CLAD POLYESTER

    SAE Technical Papers | 1992


    POLYESTER FILM, COPPER CLAD

    SAE Technical Papers | 2011


    Film, Copper Clad Polyester

    SAE Technical Papers | 1998