Bulky, monolithic power modules have so far been a characteristic element of automotive traction inverters. They are in the future about to be substituted by new generations of lean multi-chip IGBT power modules. These power modules can be customized and can easily be scaled to meet more demanding packaging requirements. But how about thermal behaviour and lifetime? Investigations have shown that vehicles mission profiles, drivetrain architecture and specific drive application create a characteristic stress pattern on the semiconductor power module. Advanced module and cooling design provides an answer. A custom-tailored thermal stack combines beneficial direct liquid cooling and lean thermal spreaders to absorb and mitigate characteristic load peaks. In consequence, a new benchmark tradeoff between lean design, power density and device lifetime can be achieved.
Custom Power under the hood - high density IGBT module tuned to automotive mission profile
2011
7 Seiten, 10 Bilder, 1 Tabelle, 11 Quellen
(nicht paginiert)
Conference paper
Storage medium
English
Anforderungsliste , Anforderungsmanagement , Bondieren , Einstellen (Maschine) , Fahrzeugantrieb , Flüssigkeitskühlung , IGBT-Modul , kundenspezifische Anpassung , Lebensdauer , Leistungshalbleiterbauelement , Leistungsmodul , thermische Ermüdung , Verbinden (Fügen) , Verpackungstechnik , Wärmespeicher , thermisches Verhalten
Hochleistungs-IGBT-Module für Automotive. Power-Module
Tema Archive | 2009
|Solder free high power IGBT module for automotive application
Tema Archive | 2008
|An Electronic High Density Packaging Concept Suitable for Under the Hood Automotive Applications
SAE Technical Papers | 1992
|High-power IGBT module for traction applications
Tema Archive | 1998
|An electronic high density packaging concept suitable for under the hood automotive applications
Automotive engineering | 1992
|