To reduce power electronic costs for hybrid electric vehicles, integrated solutions are highly recommended. The integration level is combined with the power density and the environmental demands for the power electronic and its components. Further by using only he cooling circuit of the combustion engine for the electrical machine and for the power electronic costs of an additional cooling circuit could be saved. This means that the components e. g. the silicon semiconductors have to resist very high temperature cycles and high operating temperatures. The dimensioning of the power electronic for this harsh environment depends on the requirements like driving cycle and reliability of a hybrid vehicles lifetime. In the public funded project InGA a scaleable and modular power electronic solution is developed and investigated to derive and optimize the procedure of dimensioning and integration. At this the physical and technical constraints could be investigated and future component roadmaps could be derived. Further for future semiconductor possibilities, investigations of silicon carbide (SiC) devices for elevated temperatures have been carried out. This paper gives an overview of the project tasks and the main results and also presents the experimental test setups. To demonstrate the results and providing the basis for an inverter design a power electronic unit for elevated temperatures is integrated into a Volkswagen-Touran drive train close to the combustion engine. By this the electromagnetic influences, weight, space and costs are minimized and necessary experiences for mass production are made.
InGA-project: Integrated power electronics for hybrid electric vehicles (HEV)
InGA-Projekt: Integrierte Leistungselektronik für hybridelektrische Fahrzeugnisse (HEV)
2010
10 Seiten
Conference paper
English
InGA Project: integrated power electronics for hybrid electric vehicles ( HEV )
Automotive engineering | 2010
|Automotive engineering | 2009
|Development of an integrated power electronics system for hybrid drives acc. to InGA
Automotive engineering | 2007
|