Today MEMS inertial sensors have already entered a broad market area and have mastered the step into high volume mass production, as seen on 3-axis accelerometers. The competitive product innovation cycle however gives constant pressure on the development of multi-axis and multi-type sensor systems to finally conclude in a full inertial measurement unit (IMU). Up to now the combination of accelerometer and gyrometer on one chip was limited by the incompatibility of the different operational pressure requirements. In this paper the authors introduce a new technology approach enabling the allocation of different cavity pressures on wafer level. This new concept is being industrialized with the new combi sensor SD755, which contains in a first step one accelerometer and one angular rate sensor on the same silicon chip. This paper shows the feasibility and potential performance of the enhanced PSM-X2 technology platform exemplarily for the newly introduced combi sensor SD755, which contains one accelerometer and one angular rate sensor integrated on chip level. For the first time the technological concept of combining accelerometer and gyrometer on one chip by a Multi Pressure WLP has been successfully proven, and a finalized high quality multi-type inertial sensor system is presented. With this Multi Pressure WLP it is possible to fill adjacent sensor cavities on the same wafer with different pressure levels up to a pressure ratio of 1:400 or greater. This makes this technology especially suitable for the manufacturing of inertial combi sensors, where an attenuation ratio of 1:500 or greater is needed. This technology therefore broadens up design limitations for combined accelerometer and gyrometer designs. The superior performance data of the SD755 combi sensor is presented and fits the requirements of automotive applications. Future developments will incorporate 3-axis accelerometers and 2-/3-axis gyrometers. So the finalization of a one-chip full IMU solution is only few steps away.
Combined MEMS inertial sensors for IMU applications
2009
3 Seiten, 4 Bilder, 1 Tabelle, 7 Quellen
(nicht paginiert)
Conference paper
Storage medium
German
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