For semiconductor electronics in hybrid vehicle applications with a coolant temperature up to 125 deg C, the challenge is to withstand junction temperatures up to 200 deg C. Furthermore the power semiconductor electronics is subjected to high temperature swings. These two factors are significant stress for power modules. Silicon power components can be dimensioned for operating at 200 deg C junction temperature. However, assembly and packaging for these operating conditions pose a big challenge. It can be shown with published models for lifetime prediction of standard power modules that the lifetime of the packaging technology is not sufficient for these operating conditions in hybrid vehicles. With knowledge of failure mechanisms and lifetime limiting factors in the assembly of power modules, the packaging technology can be improved for operation at high junction temperatures and high temperature swings.
Power electronics for power cycling capability at high temperatures and high temperature swings
Leistungselektronik für die Fähigkeit einer Leistungspendelung bei hohen Temperaturen und hohen Temperaturausschlägen
2009
16 Seiten, 14 Bilder, 1 Tabelle, 9 Quellen
Conference paper
English
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