Automotive and high end industrial applications require a new approach for power modules to fulfill the requirements in terms of power density, reliability and cost. A key to higher power densities of the over all drive system are higher operation temperatures and high switching frequencies. A sophisticated low inductive mechanical design and a careful selection of matched materials are a key factor to meet these goals. A new family of SKiM (Semikron Integrated Module) Sixpack power modules has been developed, taking the base plate less pressure contact module design to the next level. The robust high power and thermal cycling module design makes these modules the ideal choice for hybrid electric vehicles and other high end applications. New materials and a solder free, pressure contact packaging concept assures highest reliability even at high operation temperatures. The unique symmetrical module architecture and the laminated busbar sandwich wich multiple electrical and thermal pressure contacts assure clean switching transients, low switching losses and an extreme low package resistance.


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    Title :

    A new power module concept for automotive applications


    Contributors:
    Beckedahl, P. (author) / Grasshoff, T. (author) / Lederer, M. (author)


    Publication date :

    2007


    Size :

    5 Seiten, 9 Bilder, 1 Tabelle, 4 Quellen


    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English





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