The paper presents the general overview of the cooling microstructure concept dedicated for automotive electronic systems. It introduces the designing stage of the micro heat sink and presents the simulations examining the possibility of adaptation of standard vehicle coolant to heat overtaking from power modules mounted in cars. Vehicle thermal management problems are discussed to present the requirements for the new microchannel cooling system.
Microchannels - new concept for automotive electronic module cooling
2007
8 Seiten, 8 Bilder, 1 Tabelle, 12 Quellen
Conference paper
English
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