A system-level thermal modeling methodology for shipboard power-electronics cabinets is presented and demonstrated for a PCM-1 cabinet, a complex air-to-water-cooled cabinet design of interest to naval applications. The cabinet is completely sealed and the heat dissipation in the power electronics bays is removed from the cabinet by re-circulating the hot air through an air-to-water-cooled packaged heat exchanger that is served by an external fresh water loop. A detailed unit-wise analytical model is developed for the packaged heat exchanger used in the cabinet. Under the prescribed design parameters, the PCM-1 cabinet operating-point air circulation rate was established to be 0.434 m3/s (920 CFM). A compact model is developed for the air convection within the cabinet using 3-D Computational Fluid Dynamics/Heat Transfer (CFD/HT) simulations in conjunction with Proper Orthogonal Decomposition (POD)-based reduced order modeling techniques. The compact model runs about 350 times faster with a mean prediction error within 3.6% for the velocity field, 0.04% for the temperature field, and 0.15% for the pressure field. The resulting overall cabinet model can be integrated into a system-level modeling platform to simulate the thermal response of multiple cabinets. The CFD/HT simulations of the PCM-1 cabinet architecture suggest that its two uppermost bays would experience high air temperatures due to insufficient local air flow.
A proper orthogonal decomposition based system-level thermal modeling methodology for shipboard power electronics cabinets
Eine exakte Modellierungs-Methodik auf Systemniveau für die Wärmeregulierung in Schaltschränken für Schiffs-Leistungselektronik
Heat Transfer Engineering ; 29 , 2 ; 198-215
2008
18 Seiten, 17 Bilder, 1 Tabelle, 18 Quellen
Article (Journal)
English
A Reduced Order Modeling Framework for Thermal Modeling of Shipboard Power Electronics Cabinets
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