Thermal analysis of an electronic module housed in a 2 Modular Concept Unit (MCU, ARINC 600 standard) enclosure used in a helicopter application has been performed by means of computational fluid dynamics (CFD). The case temperature of surface-mounted components on a fully populated multi-layer double sided PCB has been evaluated for total power levels ranging from 12 W to 60 W. A simulation procedure has been proposed in order to evaluate the maximum cooling effect of power re-distribution between the PCB sides at different total power levels and for different PCB configurations, given thermal constraints for the case temperature of surface-mounted components. As a result, thermal design guidelines for electronic modules with double-sided PCBs have been developed regarding preferable power distribution between the sides of the PCB.
Thermal analysis of an electronic module with a double-sided PCB housed in a 2-MCU enclosure for avionic applications
2004
9 Seiten, 14 Bilder, 5 Tabellen, 9 Quellen
Conference paper
English
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