Recent trends in the automotive electronics industry are demanding improved reliability especially under long-term thermal cycling conditions in order to extend warranties to longer periods of time. It is believed that current challenges with solder joint failures in thermal cycling of organic printed wiring boards will be greatly improved by utilizing embedded passives technologies where the passive components are located within the layers of a multilayer board thus eliminating or greatly reducing the usage of solder. This paper will describe recent test results on printed circuit board test vehicles and a product emulator redesigned to utilize one advanced embedded resistor technology from DuPont. The original product is an engine control module which has been redesigned to utilize ceramic thick film embedded resistors. These ceramic buried resistors ranged from under 10 Ohm to greater than 100 kOhm in value and were laser trimmed to achieve high tolerance. Reliability test results including ESD, thermal cycling, and temperature-humidity testing demonstrate that the expected stability and reliability of fired ceramic thick film resistor materials can be achieved when buried within organic printed circuit boards providing a step-change improvement in performance compared to competitive embedded passive technologies.


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    Title :

    Reliability data for an engine control module emulator board containing ceramic thick film embedded resistors


    Contributors:


    Publication date :

    2003


    Size :

    6 Seiten, 6 Bilder, 5 Tabellen, 7 Quellen


    Type of media :

    Conference paper


    Type of material :

    Storage medium


    Language :

    English




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