In this paper a multichip module system for automotive applications is described. The MCM substrate is a IMS (Isolated Metal Substrate), which has been used for integration of analog signal processing stages, complex logic circuits and even power switching transistors. The main functionality of the door module implemented with this MCM, is the control of the power window motor with antipinch feature, although the prototype has been completed with communication (LIN-bus).


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    Title :

    Autodoor. Microsystem for automotive door module


    Additional title:

    Fahrzeugtür-Mikrosystem für das Fahrzeug-Türmodul


    Contributors:
    Ferre, A. (author) / Jimenez, R. (author) / Lopez, M. (author) / Bota, S.A. (author) / Merino, J.L. (author) / Samitier, J. (author) / Niessen, B. (author) / Cabruja, E. (author) / Bausells, J. (author)


    Publication date :

    2003


    Size :

    12 Seiten, 7 Bilder, 5 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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