Boeing has been developing a smart sensor system suitable for flight loads testing, which can accommodate large arrays of sensors in a bus configuration. In this paper, the authors describe their developmental effort for the past four years based on a high density multi-chip module (MCM). They have developed both analog and digital versions of transducer-to-bus-interface module (TBIM) containing a bare die MEMS pressure sensor. Fabrication and assembly processes used for these modules are also described. In addition to the sensor, the module utilized bare die ASICs and memory chips as well as a number of discrete components. The MCM substrate was fabricated on silicon, using copper as conductor and polyimide as dielectric. The MEMS device was bonded using a direct-chip-attachment process (flip chip) while other components were attached using conventional microelectronic interconnection and surface mount techniques.
Smart MEMS module assembly for aircraft applications
Die Montage Intelligenter MEMS-Module für die Flugzeugtechnik
2002
8 Seiten, 18 Bilder, 4 Quellen
Conference paper
English
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