The paper describes a new technology designed to meet the requirements of electronic controls and mechatronics under the hood. Among difficulties which had to be overcome, one will especially been illustrated. It concerns the compatibility between the chosen lead free alloy, which has a high Sn content, higher than the standard SnPb used today, and the materials of electronic device packaging and connectors. The new technology relies on a mix of a high temperature PCB, at the chosen lead free alloy and especially selected device packages and related materials suitable for long term reliability. The new technology presents an outstanding cost/performance ratio. Three different alloys have been evaluated (SnAgCu, SnAg, SnPbSb) with different melting points and Sn content, to be compared with the classical SnPbAg. In order to review the material compatibility problem the whole range of packages currently in use was tested. A complete set of components representatives has been assembled on the selected PCB high Tg substrates and submitted to the whole range of qualification tests, including thermal shocks, vibration, and humidity tests. Thermal shocks turned out to be the most severe one. In conclusion of the analysis, it has been decided to select the SnAgCu soldering alloy which presents several advantages compared to the SnPbSb: It is a lead free material and the required reflow temperature is quite compatible with usual reflow furnaces.
New laad free technology for high temperature mechatronics
Neue bleifreie Technologie für Hochtemperatur-Mechatronik
2001
7 Seiten, 19 Bilder, 8 Quellen
Conference paper
English
Aufschmelzlöten , Blei , Hochtemperaturverhalten , Legierung , Leiterverbindung , Löten , Mechatronik , Silberlot , Wärmestoß , Weichlötverbindung , Zinn , Zinnlot
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