During the past years the development of high temperature electronics has been driven forward with considerable effort, especially in the field of silicon technologies. SOI processes have reached a high maturity and by the end of the year 2000 all key ICs of the generic chipset will be available. Their introduction to the automotive market however depends on secondary factors like further reduction of substrate price - which in turn will decrease with increasing demand -, low cost HT-encapsulation and assembly techniques or the availability of passive components. Actually the lack of suited passives seems to be the bottleneck, which hinders the exploitation of HT- electronics. Finally all components have to meet the high standards of robustness, thermal stability and lifetime required by the car manufacturers over the full temperature range. The knowledge of the degradation mechanisms and the development of corresponding models and time efficient qualification methods is a further prerequisite for the introduction of 'electronics on the spot'.


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    Title :

    High temperature electronics for automotive applications


    Additional title:

    Hoch-Temperatur-Elektronik für Anwendungen im Kraftfahrzeug


    Contributors:
    Constapel, R. (author) / Freytag, J. (author) / Hille, P. (author) / Lauer, V. (author) / Wondrak, W. (author)


    Publication date :

    2000


    Size :

    7 Seiten, 7 Bilder, 1 Tabelle, 10 Quellen




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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