The advent of NASA Langley resin LaRC PETI-5 has led to the development of FM x5 Structural Adhesive. This polyimide-based adhesive shows structural properties at 350 degree F after 25,000 plus hours aging at 350 degree F. This aging-testing regimen continues. Such aging performance is the more impressive since FM x5 greatly exceeds the usual order of toughness when tested in metal to metal peel and by producing high lap shear values at low test temperatures. This paper presents test methods and data for these properties obtained up to Spring of 1998. In addition, test procedures and results are presented for shear stress-strain properties obtained with the KGR-1 extensometer on titanium thick-adherend specimens. Special techniques are described to overcome titanium hardness resistance to penetration of the mounting points of the KGR-1 extensometer. The data promises bonded structure for high speed commercial aircraft where aerodynamic heating precludes aluminum structure.
Long term high temperature polyimide structural adhesive
1999
11 Seiten, 4 Quellen
Conference paper
English
Aluminum ions enhance polyimide adhesive
NTRS | 1981
|Larc-13 polyimide adhesive bonding
Tema Archive | 1979
|Adhesive, Polyimide Resin, Film and Paste High Temperature Resistant, 315 °C (599 °F)
SAE Technical Papers | 2022
ADHESIVE, POLYIMIDE RESIN, FILM AND PASTE High Temperature Resistant, 315°C or 600°F
SAE Technical Papers | 1975
High-Temperature Polyimide Resin
NTRS | 1990
|