The future of multi-chip film circuit technology for professional and military use can be summarised as: (1) the difference in precision and stability between thin and thick films is narrowing; (2) major changes are expected in assembly and encapsulation methods; (3) development of computer-controlled automatic methods of manufacture of complex multi-chip circuits; (4) monolithic circuit chips and film technology provides a basis for future electronic equipment.


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    Title :

    Thin and thick film for professional and military applications


    Additional title:

    Duenn- und Dickschichttechnik: Anwendungsbereich Industrie und Wehrtechnik


    Contributors:
    Boswell, D. (author)

    Published in:

    New Electronics ; 8 , 6 ; 54-55


    Publication date :

    1975


    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English





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