Unique packaging problems exist in the automotive microelectronics business that do not exist in many conventional microelectronic applications. Ultra high reliability, and long life expectancies of components as required by the auto industry is made more difficult by the harsh environment these circuits are subjected to. In addition competition in the automobile market which is International in scope is forcing the industry to find new, inexpensive approaches for the packaging of sophisticated engine electronic functions. Also, space is becoming a premium, which means more and more electronics must be placed in smaller and smaller packages. Many new approaches are being evaluated for automotive applications. Much work must be done to prove out the long term reliability. Processes and materials successfully used in a home computer, calculator or similar benign environment, do not necessarily make them appropriate for automotive applications. This is especially true when components are being placed under the hood of an automobile or truck. Passing 100 to 500 thermal cycles is no longer good enough to render the part useful in these applications.


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    Title :

    Hybrids that pass the rigors of the automotive environment


    Additional title:

    Hybridschaltungen, die die strengen Anforderungen der Umgebungseinfluesse im Kraftfahrzeug erfuellen


    Contributors:


    Publication date :

    1986


    Size :

    3 Seiten


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English