The installation of electronic circuitry in modern automobiles is following a rapidly increasing pattern. Those units are exposed to environmental conditions of the most stringent nature and therefore special consideration has to be given to the packaging technology. Because of their unique property profile, silicone potting and encapsulating materials have established themselves as the ideal protective media for car electronic systems. An entirely new family of HIPEC silicone self priming elastomers will also be described. Application cases of on-board electronic packaging will be discussed including potting of modules with flexible encapsulants and coatings of printed circuit-boards. A separate section will be devoted to the protection of hybrid circuits for under-bonnet use. The increased complexity of hybrids has created specific needs for products such as high purity 'blob coatings' for naked semi-conductor protection; flexible thermally conductive adhesives to provide a compliant bond between the ceramic substrate and metal heat sink; stress relieving encapsulation materials and finally, high strength yet flexible structural adhesives to assemble dissimilar materials like plastics and metals.
New silicone materials for reliable packaging
Neue Silizium-Materialien fuer den zuverlaessigen Geraetebau
1985
5 Seiten, 8 Quellen
Conference paper
English
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