In order to successfully apply custom ICs to the automobile, careful attention must be given to the climatic and electrical environment as described in this tutorial. Today, special interface circuits, including discrete protection components, are used to keep the transients described in Table 1 from literally destroying ICs. It is highly desirable that new IC designs tolerate these transients and avoid the use of costly external components. The development and application of adequate testing methods are mandatory for acceptance of new automotive custom ICs. The long lead times and high volume production needs of the automotive market are not flexible with respect to quick fixes or production changes. Continued widespread use of custom ICs is expected to occur in the future. Understanding the needs of the automotive system designer, as presented in this tutorial, will equip the chip designer with basic information needed to obtain a sucdessful design.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Automotive electronics: designing custom ICs for a harsh environment


    Additional title:

    Kraftfahrzeugelektronik: Entwurf kundenspezifischer integrierter Schaltungen fuer hohe Beanspruchungen


    Contributors:
    Motz, P.R. (author) / Vincent, W.A. (author)


    Publication date :

    1983


    Size :

    7 Seiten, 6 Bilder, 1 Tabelle, 10 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Automotive electronics: designing custom ICs for a harsh environment

    Motz, P.R. / Vincent, W.A. | Tema Archive | 1984


    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

    Fairchild, M. R. / Snyder, R. B. / Berlin, C. W. et al. | British Library Conference Proceedings | 2002


    Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications

    Berlin, Carl W. / Sarma, D.H.R. / Fairchild, M. Ray et al. | SAE Technical Papers | 2002