Wafer defect detection is a critical part of the semiconductor wafer manufacturing industry. Human-based manual defect detection is tedious and often prone to misjudgement. Hence, there is a push towards automatic wafer defect detection in the industry. This paper shall investigate the efficacy of a transfer learning pipeline that utilizes different pre-trained VGG models, i.e., VGG16 and VGG19, that act as a feature extractor coupled with a Random Forest (RF) model in classifying wafer defect images. The hyperparameter of the RF classifier is further fine-tuned through the grid-search technique via a five-fold cross-validation method. It was shown in the study that the optimised VGG16+RF pipeline provided a better classification of the wafer defects.


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    Title :

    The Classification of Semiconductor Wafer Defects by Means of Feature-based Transfer Learning Approach


    Additional title:

    Lect. Notes in Networks, Syst.



    Conference:

    International Conference on Robot Intelligence Technology and Applications ; 2023 ; Taicang December 06, 2023 - December 08, 2023



    Publication date :

    2024-11-29


    Size :

    7 pages





    Type of media :

    Article/Chapter (Book)


    Type of material :

    Electronic Resource


    Language :

    English




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