Bond strength tests are the most widely accepted methods for controlling the quality of the wire bonding operation, and thereby offering added assurance that semiconductor devices will not fail in the field due to weak wire bonds. In this paper, three destructive bond strength tests are investigated in Au/Al and Al/Al bonding interface. Experiments demonstrate that wire bond shear test and wire pull test (single bond) can reflect the bonding state of the Au/Al interface more accurately than wire pull test (double bond). To obtain the most reliable data, combining wire bond shear test and its wedge bond lift offs records would be the best choice for Au/Al interface stability.
On the Performance of Destructive Bond Strength Tests in Wedge Welding Stability
Lect.Notes Mechanical Engineering
International Conference on Mechanical, Automotive and Materials Engineering ; 2023 ; Da Nang, Vietnam December 20, 2023 - December 22, 2023
Proceedings of the 10th International Conference on Mechanical, Automotive and Materials Engineering ; Chapter : 23 ; 273-281
2024-09-25
9 pages
Article/Chapter (Book)
Electronic Resource
English
NTIS | 1965
NTIS | 1965
NON-DESTRUCTIVE OPTICAL METHOD FOR DETERMINING MINIMUM BOND STRENGTH AND PROVING BOND EFFICACY
European Patent Office | 2019
|Non-destructive optical method for determining minimum bond strength and proving bond efficacy
European Patent Office | 2019
|NTIS | 1965