As one of the ideal switching devices in the field of power electronics, IGBT has been widely used in many fields. However, due to the long-term operation of IGBT in high voltage, high current and high frequency switching state, IGBT power consumption and junction temperature fluctuate frequently, which leads to temperature rise and thermal stress deformation, and ultimately leads to IGBT device fatigue aging. Based on the electrothermal model of IGBT and rain flow method are used to evaluate the fatigue aging of IGBT module. Finally, the statistical characteristics of junction temperature load are obtained and the life prediction of IGBT module was completed.


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    Title :

    IGBT Module Life Prediction Based on Rain Flow Method and Junction Temperature Analysis


    Additional title:

    Lect. Notes Electrical Eng.


    Contributors:
    Qin, Yong (editor) / Jia, Limin (editor) / Liang, Jianying (editor) / Liu, Zhigang (editor) / Diao, Lijun (editor) / An, Min (editor) / Li, Xiaobing (author) / Zhou, Mingchao (author)

    Conference:

    International Conference on Electrical and Information Technologies for Rail Transportation ; 2021 October 21, 2021 - October 23, 2021



    Publication date :

    2022-02-23


    Size :

    8 pages





    Type of media :

    Article/Chapter (Book)


    Type of material :

    Electronic Resource


    Language :

    English




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