This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability. Aerospace, defense, and high performance (ADHP) manufacturers have avoided a transition to Pb-free for most products, but the limited availability of ball grid array packages with SnPb alloy solder balls has driven the use of parts with Pb-free solder balls. There have been numerous studies on the use of the Pb-free parts in a SnPb assembly, and this document provides a consolidated summary of the industry best practices and issues related to use of these Pb-free parts.


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    Title :

    Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder


    Publication date :

    2019-07-23



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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