Many investigators who have studied the reactions of various gases and contaminants on solid state device operating characteristics have not particularly concerned themselves with the process origins of these gases and contaminants. Analysis of the contents of hermetic device packages at Autonetics has revealed large variances in composition and concentration of these gases and contaminants. Once the gas or contaminant had been established as deleterious to the operation of the device, it was necessary to determine its origin. It was assumed that all deleterious materials of concern to the study were process oriented. The techniques utilized by various manufacturers to make hermetic packages were compared for common practices associated with the closure techniques, the ambients, the temperatures, and their controls. These were carefully evaluated and compared to the analyses performed using mass spectrographic and gas chromatographic techniques. Also, solid contaminants trapped inside the device due to processes occurring prior to the seal operation were traced to their origin using analytical techniques including the electron microprobe. Results of these studies indicated major sources of impurities to be (1) dry box ambients, (2) outgassing for metal surfaces, (3) residual processing solvents, (4) weld flash, etc. This paper describes some examples of joint studies involving Autonetics and its suppliers which resulted in corrective actions which eliminated these process oriented impurities. For example, open aluminum interconnects in integrated circuits were determined to be caused by chloride corrosion present as a result of incomplete cleaning processes.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    The Process Origin of Impurities in Hermetic Electronic Device Packages


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Electronic Packaging Conference ; 1967



    Publication date :

    1967-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





    Hermetic Packages For Millimeter-Wave Circuits

    Herman, Martin I. / Lee, Karen A. / Lowry, Lynn E. et al. | NTRS | 1994


    Optical interconnect within hermetic packages using holograms [2400-42]

    Huang, K.-S. / Shaw, R. R. / SPIE | British Library Conference Proceedings | 1995



    Rapid evaluation of hermetic seals in automotive microelectronic packages using shearography

    Hung,Y.Y. / Shi,D. / Oakland Univ.,US | Automotive engineering | 1996