A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network that enhances cooling efficiency and minimizes the pressure drop across the device. Experimental test results are presented. Tests to date indicate that up to 76.5 W/cm2 may be removed by the heat sink based on a 100°C electronic device temperature.


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    Title :

    Micromachined Heat Sinks


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Aerospace Power Systems Conference ; 1999



    Publication date :

    1999-04-06




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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