A novel extruded aluminum heat exchanger for cooling power semiconductor devices used in hybrid vehicles is described. The patented and patent pending design employs an enhanced heat transfer surface and turbulence generating devices to efficiently remove heat from devices, such as IGBTs, and reject it into the vehicles coolant loop. Heat transfer rates approach brazed plate-fin designs while the pressure drop remains low at high coolant flow.


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    Title :

    New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    Vehicle Thermal Management Systems Conference & Exposition ; 2001



    Publication date :

    2001-05-14




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    New, high efficiency, low cost liquid heat exchanger for cooling power semiconductor devices

    Wright,C.C. / Wright,J.F. / Solid State Cooling Systems,US | Automotive engineering | 2001


    2001-01-1743 New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices

    Wright, C. C. / Wright, L. F. / Society of Automotive Engineers | British Library Conference Proceedings | 2001


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