Intel's Package Development Group began development of Tape Automated Bonding (TAB) (See Figure 1) for two primary purposes: as a lead frame to device interconnect for high lead count products; and, as a stand-alone for surface-mounted-devices (SMD). New production assembly equipment, bumping equipment and tape technology have made it possible for TAB to become production-worthy.Intel, over the past few years, has made progress in the development of TAB technology. Using a 16-bit micro-controller as the process characterization vehicle, numerous milestones have been accomplished: tape design, carrier design, and assembly development. The 16-bit micro-controller has been tested to an Automotive product type flow and a number of piece part specifications have been generated. In addition, much of the production equipment has been characterized, and process characterization is well under way.


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    Title :

    Tape Automated Bonding


    Additional title:

    Sae Technical Papers


    Contributors:
    Lynch, John (author) / Howard, Randy (author)

    Conference:

    SAE Future Transportation Technology Conference and Exposition ; 1987



    Publication date :

    1987-08-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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