Intel's Package Development Group began development of Tape Automated Bonding (TAB) (See Figure 1) for two primary purposes: as a lead frame to device interconnect for high lead count products; and, as a stand-alone for surface-mounted-devices (SMD). New production assembly equipment, bumping equipment and tape technology have made it possible for TAB to become production-worthy.Intel, over the past few years, has made progress in the development of TAB technology. Using a 16-bit micro-controller as the process characterization vehicle, numerous milestones have been accomplished: tape design, carrier design, and assembly development. The 16-bit micro-controller has been tested to an Automotive product type flow and a number of piece part specifications have been generated. In addition, much of the production equipment has been characterized, and process characterization is well under way.
Tape Automated Bonding
Sae Technical Papers
SAE Future Transportation Technology Conference and Exposition ; 1987
1987-08-01
Conference paper
English
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