Today the majority of power electronics is developed based on the requirements set by the main fields of application e.g. power generation, power supply, industrial drive and traction. With introduction to automotive applications new requirements have to be taken into account. This paper discusses how interconnection technologies for power semiconductors can be improved to meet the demand for higher temperature capability in HEV applications.


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    Title :

    Design Considerations for Power Electronics in HEV Applications


    Additional title:

    Sae Technical Papers


    Contributors:
    Rüthing, H. (author) / Münzer, M. (author) / Thoben, M. (author) / Ahmed, S. (author)

    Conference:

    SAE World Congress & Exhibition ; 2007



    Publication date :

    2007-04-16




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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