The field of integrated solid-state technology is most broad. In this paper, hybrid monolithic thin-film and thick-film technologies are discussed with emphasis on monolithic integrated circuits. Processing, component construction, characteristics and limitations of the components, and pertinent parasitic effects are described and illustrated. Packaging, thermal considerations, reliability, and cost are discussed as well.


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    Title :

    Integrated Solid-State Devices


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    1974 Automotive Engineering Congress and Exposition ; 1974



    Publication date :

    1974-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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