This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure. This document has been revised to remove specific military requirements described in former sections 4.2.2.1, 5.1.5, and 8.3. MIL-STD-2073-1 was also deleted from section 2.3 since it was referenced in section 5.1.5.


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    Title :

    Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)


    Publication date :

    2010-11-05



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English