This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.


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    Title :

    RESIN, POLYIMIDE, LAMINATING High Temperature Resistant, 315°C (600°F)


    Publication date :

    1991-10-01



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English