An FEA (Finite Element Analysis) model was developed based on the physical dimension of the MOSFET device to produce a Zth curve closely matching the experimental Zth curve. This Finite Element Analysis model would then be extrapolated down to the region beyond the capability of the hardware of the Zth measurement system


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    Title :

    Zth Thermal Modelling of MOSFET in Sub-Milliseconds Range


    Additional title:

    Sae Technical Papers


    Contributors:
    Kwan, Alex (author) / Ambrus, John (author) / Downer, Scott (author) / Tran, Thanh (author) / McDonald, Tim (author)

    Conference:

    SAE 2004 World Congress & Exhibition ; 2004



    Publication date :

    2004-03-08




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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