This specification covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.


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    Title :

    POTTING COMPOUND, EPOXY Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant


    Publication date :

    1986-01-01



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English