This paper reviews the steps taken by the semiconductor industry to be responsive to the requirements of the automotive industry, with special emphasis on one recently developed and highly cost-effective method to control and improve device reliability. Two new product innovations, one combining MOS and bipolar technology to produce a high performance and versatile operational amplifier integrated circuit, and the other an inherently more reliable process for IC manufacture involving a hermetic silicon die and a corrosion resistant lead connection system are also described, particularly as they relate to automotive applications.


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    Title :

    Auto Electronics: A Semiconductor Supplier's Viewpoint


    Additional title:

    Sae Technical Papers


    Contributors:

    Conference:

    1975 Automotive Engineering Congress and Exposition ; 1975



    Publication date :

    1975-02-01




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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