This paper reviews the steps taken by the semiconductor industry to be responsive to the requirements of the automotive industry, with special emphasis on one recently developed and highly cost-effective method to control and improve device reliability. Two new product innovations, one combining MOS and bipolar technology to produce a high performance and versatile operational amplifier integrated circuit, and the other an inherently more reliable process for IC manufacture involving a hermetic silicon die and a corrosion resistant lead connection system are also described, particularly as they relate to automotive applications.
Auto Electronics: A Semiconductor Supplier's Viewpoint
Sae Technical Papers
1975 Automotive Engineering Congress and Exposition ; 1975
1975-02-01
Conference paper
English
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