An interface concept has been developed which produces high conductance at a thermal/mechanical joint without resorting to high clamping forces or potentially contaminating fillers such as thermal grease. This paper discusses the characteristics of several variations of the high conductance interface concept and compares them to those of existing interface concepts proposed for several Space Station applications. The application of the high conductance concept to thermal joints such as internal coldplate interfaces and external equipment module to heat acquisition plate interfaces would reduce the weight and complexity and increase the efficiency of the Space Station Thermal Management System.
High Conductance Thermal Interface Concept for Space Applications
Sae Technical Papers
International Conference On Environmental Systems ; 1991
1991-07-01
Conference paper
English
Thermal interface conductance in a vacuum
AIAA | 1964
|Interface thermal conductance in a vacuum
AIAA | 1965
|